Alphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 12 days agoIntel's make-or-break 18A process node debuts for data center with 288-core Xeon 6+ CPU — multi-chip monster sports 12 channels of DDR5-8000, Foveros Direct 3D packaging techwww.tomshardware.comexternal-linkmessage-square7linkfedilinkarrow-up139arrow-down11cross-posted to: hackernews@lemmy.bestiver.se
arrow-up138arrow-down1external-linkIntel's make-or-break 18A process node debuts for data center with 288-core Xeon 6+ CPU — multi-chip monster sports 12 channels of DDR5-8000, Foveros Direct 3D packaging techwww.tomshardware.comAlphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 12 days agomessage-square7linkfedilinkcross-posted to: hackernews@lemmy.bestiver.se
minus-squareAlphane Moon@lemmy.worldOPMlinkfedilinkEnglisharrow-up12·12 days agoI initially (just for a brief moment) thought intel somehow add Direct3D (DirectX) support on their CPUs without turning it into an iGPU.
minus-squareAvid Amoeba@lemmy.calinkfedilinkEnglisharrow-up2·12 days agoI’m waiting for Glide 3D to hit their hw.
I initially (just for a brief moment) thought intel somehow add Direct3D (DirectX) support on their CPUs without turning it into an iGPU.
I’m waiting for Glide 3D to hit their hw.