Alphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 13 days agoIntel's make-or-break 18A process node debuts for data center with 288-core Xeon 6+ CPU — multi-chip monster sports 12 channels of DDR5-8000, Foveros Direct 3D packaging techwww.tomshardware.comexternal-linkmessage-square7linkfedilinkarrow-up139arrow-down11cross-posted to: hackernews@lemmy.bestiver.se
arrow-up138arrow-down1external-linkIntel's make-or-break 18A process node debuts for data center with 288-core Xeon 6+ CPU — multi-chip monster sports 12 channels of DDR5-8000, Foveros Direct 3D packaging techwww.tomshardware.comAlphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 13 days agomessage-square7linkfedilinkcross-posted to: hackernews@lemmy.bestiver.se
minus-squareAvid Amoeba@lemmy.calinkfedilinkEnglisharrow-up2·13 days agoI’m waiting for Glide 3D to hit their hw.
I’m waiting for Glide 3D to hit their hw.